| 摘要 |
Provided is an electronic component capable of suppressing variation between plating growth dimensions of plating films forming external electrodes. External electrodes (41, 42) include plating films (43, 44) formed by electroplating so as to extend from each end surface (37, 38) of an electronic component base body (32) to side surfaces (3-6). Base main electrodes (61, 62) having a comparatively high degree of plating growth and base auxiliary electrodes (63, 64) having a comparatively low degree of plating growth are formed as seed electrodes that serve as the origin for plating growth for plating film formation. The base main electrodes comprise end surface base electrodes (45, 46) and first side surface base electrodes (47a, 48a) electrically connected to each of these. The base auxiliary electrodes comprise second side surface base electrodes (47b, 48b). The second side surface base electrodes (47b, 48b) forming the base auxiliary electrodes are positioned along the end edges (43a, 44a) of the plating films (43, 44). |
