| 发明名称 |
MODULE |
| 摘要 |
A module includes a first partial housing and a second partial housing, wherein the first partial housing and the second partial housing together form a recess, a circuit board disposed in the recess; and an encapsulation mass, which closes the recess. A material from which the first partial housing is manufactured and a material from which the second partial housing is manufactured have a difference in thermal expansion coefficients that is at most 10% of the largest value of the two thermal expansion coefficients, the first partial housing includes a sealing structure and the second partial housing includes a counter-sealing structure, and at least one of the sealing structure and the counter-sealing structure is configured to extend into the other of the sealing structure and the counter-sealing structure. |
| 申请公布号 |
US2015282335(A1) |
申请公布日期 |
2015.10.01 |
| 申请号 |
US201514672362 |
申请日期 |
2015.03.30 |
| 申请人 |
Biegner Johannes;Graf Jens;Verhulst Laurens |
发明人 |
Biegner Johannes;Graf Jens;Verhulst Laurens |
| 分类号 |
H05K5/00;H05K5/06;H05K5/02 |
主分类号 |
H05K5/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A module comprising:
a first partial housing and a second partial housing, wherein the first partial housing and the second partial housing together form a recess; a circuit board disposed in the recess; and an encapsulation mass, which closes the recess, wherein a material from which the first partial housing is manufactured and a material from which the second partial housing is manufactured have a difference in thermal expansion coefficients that is at most 10% of the largest value of the two thermal expansion coefficients; wherein the first partial housing includes a sealing structure and the second partial housing includes a counter-sealing structure; and wherein at least one of the sealing structure and the counter-sealing structure is configured to extend into the other of the sealing structure and the counter-sealing structure. |
| 地址 |
Prichsenstadt DE |
