DUAL-INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE DUAL-INTERFACE IC CARD COMPONENTS

摘要

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate, which is a component of a dual-interface IC card. Other embodiments are also described.

主权项

1. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:
obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and attaching at least one antenna contact lead to the single-sided contact base structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate to form a dual-interface contact structure, which is a component of a dual-interface IC card.