发明名称 |
MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEMBLIES |
摘要 |
An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer. |
申请公布号 |
US2015277068(A1) |
申请公布日期 |
2015.10.01 |
申请号 |
US201514687119 |
申请日期 |
2015.04.15 |
申请人 |
Cisco Technology, Inc. |
发明人 |
DESAI Kishor;Kachru Ravinder;Patel Vipulkumar;Dama Bipin;Shastri Kalpendu;Pathak Soham |
分类号 |
G02B6/42;G02B6/13 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
1. An opto-electronic assembly, comprising
a substrate supporting a plurality of interconnected optical and electrical components, the substrate including a layer of sealing material disposed to outline a defined area of a top surface thereof; and a molded glass lid disposed over and bonded to the substrate, the molded glass lid configured to create a footprint that matches the defined area of the substrate and including a layer of bonding material on a bottom surface, and the layer of bonding material contacting the layer of sealing material upon placement of the molded glass lid on the substrate to create a bonded assembly. |
地址 |
San Jose CA US |