COMPOSITION, LAMINATE FOR UNDERFILL, LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

Provided are: a composition which has excellent storage stability, coatability and curability and is capable of forming a film having low water absorption and excellent heat resistance; a laminate for underfill; a laminate using same; a method for manufacturing a semiconductor device; and a semiconductor device. This composition contains a polycarbonate resin, a polymerizable compound and a solvent. The solvent is contained in the composition in an amount of 50% by mass or more, and 50% by mass or more of the solvent is composed of an aprotic solvent having a boiling point of 130°C or more and a molecular weight of 75 or more. It is preferable that the polycarbonate resin has a repeating unit represented by general formula (1). In general formula (1), each of Ar1 and Ar2 independently represents an aromatic group; and L represents a single bond or a divalent linking group.