| 摘要 |
The invention relates to a method for temporarily coating cavities (2), with which a semiconductor substrate (1) is at least partially interspersed and which are intended for a permanent coating and/or component mounting, with a temporarily applied coating material (3) before processing steps for processing at least one surface (1o) of the semiconductor substrate (1). The invention further relates to a method for removing a temporary coating from cavities (2) of a semiconductor substrate (1), wherein the coating has been or is applied according to an aforementioned method and wherein thereafter, in particular immediately thereafter, a permanent coating and/or component mounting of the cavities (2) occurs. |
