| 摘要 |
<p>The present invention provides a method for separating a film for a semiconductor using a pair of taping units which includes an erect location step (S10) of enabling an erect loading device to erect a substrate which is horizontal on the ground for locating one of lines connecting a vertex of the substrate in parallel to a gravity direction, a taping unit attaching step (S20) of enabling a taping unit transfer device (20) to approach two taping units (T1,T2) mounting an adhesive tape on both sides of the substrate to face each other for attaching the taping units on the square edges of films (F) attached on both sides of the substrate, a preliminary separation step (S30) by the taping unit of enabling the taping unit transfer device (20) to moves the taping units (T1,T2) in an opposite direction at the same time for separating the film from the top square edge of the substrate, and a main separation step (S40) of enabling a clamper lifting unit (40) to lift a clamper (41) which clamps the top square edge of the substrate for separating the film from the substrate.</p> |
