发明名称 THERMALLY-EXPANDABLE MICROCAPSULE
摘要 <p>PROBLEM TO BE SOLVED: To provide a thermally-expandable microcapsule hardly causing coloration and/or smell when used for foam molding while having a high foaming magnification ratio and durability at high temperature: to provide a foamable thermoplastic resin master batch using the thermally-expandable microcapsule: to provide a foam molding body: and to provide a method for producing the thermally-expandable microcapsule.SOLUTION: A thermally-expandable microcapsule is such that a volatile expansion agent as a core agent is included in a shell comprising polymer. The shell is formed by polymerizing a monomer composition including a nitrile-based monomer, a monomer having an amide group and a chemical compound having a glycyl group in the molecules. The monomer having the amide group includes at least one kind selected from acrylamide and methacrylamide. The monomer composition includes 0.9-20 wt.% of the monomer having the amide group and 0.1-15 wt.% of the chemical compound having the glycyl group.</p>
申请公布号 JP2015172190(A) 申请公布日期 2015.10.01
申请号 JP20150032188 申请日期 2015.02.20
申请人 SEKISUI CHEM CO LTD 发明人 MORITA HIROYUKI;YAMAUCHI HIROSHI;HANEDA SATOSHI
分类号 C09K3/00;C08J9/32 主分类号 C09K3/00
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