发明名称 ADHESIVE BODY BETWEEN CONDUCTIVE POLYMER-METAL COMPLEX AND SUBSTRATE AND METHOD FOR FORMING THE SAME, CONDUCTIVE POLYMER-METAL COMPLEX DISPERSION LIQUID, METHOD FOR MANUFACTURING THE SAME AND METHOD FOR APPLYING THE SAME, AND METHOD FOR FILLING HOLE USING CONDUCTIVE MATERIAL
摘要 A conductive polymer-metal complex becomes to be adhered simply and strongly on the surface of a substrate such as PTFE. By subjecting a solution containing a monomer which provides a conductive polymer, an anion, and a metal ions such as Ag+, Cu2+, Cu+ and the like to an irradiation with light having an energy required for exciting an electron to an energy level capable of reducing the metal ion, such as ultraviolet light, under an appropriated condition, thereby precipitating the conductive polymer-metal complex as being dispersed in the reaction liquid. By supplying this dispersion liquid onto various substrates, the complex microparticles in the dispersion liquid enter into and mate with the narrow holes on the surface of the substrate. As a result, the complex precipitate formed on the surface of the substrate and the substrate can be adhered strongly to each other.
申请公布号 US2015282310(A1) 申请公布日期 2015.10.01
申请号 US201314438004 申请日期 2013.10.21
申请人 NATIONAL INSTITUTE FOR MATERIALS SCIENCE 发明人 Kawakita Jin;Chikyo Toyohiro;Hashimoto Yasuo;Horvath Barbara
分类号 H05K1/09 主分类号 H05K1/09
代理机构 代理人
主权项 1. An adhesive body between a conductive polymer-metal complex and a substrate, wherein a conductive polymer-metal complex comprising an organic conductive polymer and metal nanoparticles with at least a part of the metal nanoparticles being exposed on the surface of the organic conductive polymer is adhered to the surface of the substrate; and, microparticles of the complex which have entered into narrow holes on the surface of the substrate serve to engage the complex adhering to the surface of the substrate with the substrate.
地址 Ibaraki JP