Mechanical Quantity Measuring Device

摘要

A load cell including sensor chip (1) on which plural resistive elements rectangular in a plan view are formed, and a member (2) is provided on a front surface side of a semiconductor substrate made of silicon single crystal. The member (2) includes a load portion (3), a fixed pedestal portion (4), and a strain generation portion (5) that is spaced apart from the load portion (3) and the fixed pedestal portion (4), and arranged between the load portion (3) and the fixed pedestal portion (4). The sensor chip (1) is attached onto a front side surface (2a) of the strain generation portion (5) of the member (2) so that a <100> direction of the silicon single crystal in the semiconductor substrate is parallel to a load direction, and a longitudinal direction of the plural resistive elements has an angle of 45° with respect to a load direction.

主权项

1. A mechanical quantity measuring device having a load cell formed of a sensor chip and a member to which the sensor chip is attached,
wherein the sensor chip includes a semiconductor substrate of a first conductivity type having a front surface and a rear surface opposite to the front surface, a plurality of resistive elements formed on the front surface side of the semiconductor substrate, and a plurality of electrodes formed on a peripheral portion of the front surface side of the semiconductor substrate, wherein the member includes a load portion having an upper surface to which a load is applied, a fixed pedestal portion, a strain generation portion arranged between the load portion and the fixed pedestal portion so as to be spaced apart from the load portion and the fixed pedestal portion, a first connection portion that connects one end of the load portion to one end of the strain generation portion, and a second connection portion that connects the other end of the strain generation portion opposite to one end of the strain generation portion to one end of the fixed pedestal portion, wherein the sensor chip is attached to a center portion of a first side surface of the strain generation portion of the member through a joint material so that the rear surface of the semiconductor substrate is joined thereto, and wherein the semiconductor substrate is made of silicon single crystal, and a <100> direction of the silicon single crystal is parallel to a load direction.