发明名称 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
摘要 Provided are: a photosensitive resin composition which enables a cyclization reaction of a heterocycle-containing polymer precursor at low temperatures, and which is capable of forming a pattern having excellent resolution; a cured film which is obtained using the photosensitive resin composition; a method for producing a cured film; and a semiconductor device. A photosensitive resin composition which contains: a compound that has a cationic moiety represented by general formula (A) and an anionic moiety having radical initiation ability; a heterocycle-containing polymer precursor; and a radically polymerizable compound. In general formula (A), Ar1 represents an aromatic group; each of R1-R5 independently represents a hydrogen atom or a monovalent organic group, and R4 and R5 may combine together to form a ring; and n represents an integer of 1 or more.
申请公布号 WO2015146949(A1) 申请公布日期 2015.10.01
申请号 WO2015JP58831 申请日期 2015.03.24
申请人 FUJIFILM CORPORATION 发明人 IWAI YU;KOYAMA ICHIRO
分类号 G03F7/029;G03F7/004;G03F7/027;G03F7/031;G03F7/037 主分类号 G03F7/029
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