发明名称 Film Forming Apparatus Using Gas Nozzles
摘要 A film forming apparatus includes: first and second source gas nozzles installed so as to extend in an arrangement direction of the substrates, each of the source gas nozzles including a plurality of gas ejection holes formed to eject the source gas toward central regions of the substrates at height positions corresponding to gaps between the substrates; a reaction gas supply unit configured to supply the reaction gas into the reaction vessel; first and second source gas supply lines respectively connected to the first and second source gas nozzles; first and second tanks respectively installed on the first and source gas supply lines, and configured to accumulate the source gas in a pressurized state; valves respectively installed at upstream and downstream sides of the first tank and at upstream and downstream sides of the second tank; and an exhaust port configured to evacuate the interior of the reaction vessel.
申请公布号 US2015275368(A1) 申请公布日期 2015.10.01
申请号 US201514666874 申请日期 2015.03.24
申请人 TOKYO ELECTRON LIMITED 发明人 MOTOYAMA Yutaka;FUKUSHIMA Kohei;MATSUNAGA Masanobu;TONEGAWA Yamato;SUZUKI Keisuke
分类号 C23C16/455;C23C16/458;C23C16/44 主分类号 C23C16/455
代理机构 代理人
主权项 1. A film forming apparatus configured to form films on a plurality of substrates by alternately supplying a source gas and a reaction gas, which reacts with the source gas to form a reaction product, into the reaction vessel in a state in which a substrate holder holding the plurality of substrates in a shelf form is disposed within a vertical reaction vessel kept at a vacuum atmosphere, the film forming apparatus comprising: a first source gas nozzle and a second source gas nozzle installed so as to extend in an arrangement direction of the substrates, each of the first source gas nozzle and the second source gas nozzle including a plurality of gas ejection holes formed so as to eject the source gas toward central regions of the substrates at height positions corresponding to gaps between the substrates; a reaction gas supply unit configured to supply the reaction gas into the reaction vessel; a first source gas supply line and a second source gas supply line respectively connected to the first source gas nozzle and the second source gas nozzle; a first tank and a second tank respectively installed on the first source gas supply line and the second source gas supply line, and configured to accumulate the source gas in a pressurized state; valves respectively installed at upstream and downstream sides of the first tank and at upstream and downstream sides of the second tank; and an exhaust port configured to evacuate the interior of the reaction vessel, wherein the gas ejection holes of both of the first source gas nozzle and the second source gas nozzle are disposed at a central height region in an arrangement direction of a height region where the substrates are arranged, and the gas ejection holes of at least one of the first source gas nozzle and the second source gas nozzle are disposed in regions other than the central height region.
地址 Tokyo JP