| 摘要 |
A heat sink device includes a thermally conducting base plate configured to be thermally coupled to a heat source. A cover is located substantially opposite the base plate. A plurality of thermally conducting partitions extends laterally from the base plate to the cover. A lateral edge of each partition is in thermal contact with the base plate. The partitions partition a space between base plate and cover into an array of elongated channels with open opposite ends. When the base plate is thermally coupled to a heat source and the open opposite ends of a channel of the array of channels are aligned substantially vertically, a chimney effect air flow is sustained within each channel. |
