| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the semiconductor chip and the carrier and a second conducting line having a second thickness and being deposited over the semiconductor chip and the carrier. The first thickness is smaller than the second thickness. |
| 申请公布号 |
US2015279782(A1) |
申请公布日期 |
2015.10.01 |
| 申请号 |
US201514735604 |
申请日期 |
2015.06.10 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Ewe Henrik;Mahler Joachim;Mengel Manfred;Engl Reimund;Hoeglauer Josef;Dangelmaier Jochen |
| 分类号 |
H01L23/538;H01L23/495;H01L21/288;H01L21/768;H01L21/02;H01L21/311;H01L23/31;H01L23/498 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a carrier; a semiconductor chip attached to the carrier; a first conducting line having a first thickness and being deposited over the semiconductor chip and the carrier; a second conducting line having a second thickness and being deposited over the semiconductor chip and the carrier; and wherein the first thickness is smaller than the second thickness. |
| 地址 |
Neubiberg DE |
