| 发明名称 |
POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER |
| 摘要 |
Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described. |
| 申请公布号 |
US2015273655(A1) |
申请公布日期 |
2015.10.01 |
| 申请号 |
US201514732497 |
申请日期 |
2015.06.05 |
| 申请人 |
Allison William C.;Scott Diane;Lefevre Paul Andre;LaCasse James P.;Simpson Alexander William |
发明人 |
Allison William C.;Scott Diane;Lefevre Paul Andre;LaCasse James P.;Simpson Alexander William |
| 分类号 |
B24B37/24;B24D11/00;B24D18/00;B24B37/26 |
主分类号 |
B24B37/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing pad for polishing a substrate, the polishing pad comprising:
a foundation layer having an energy loss factor of less than approximately 100 KEL at 1/Pa at 40° C.; and a polishing surface layer attached to the foundation layer, the polishing surface layer having an energy loss factor of greater than approximately 1000 KEL at 1/Pa at 40° C., wherein the foundation layer and the polishing surface layer together have an energy loss factor of less than approximately 100 KEL at 1/Pa at 40° C. |
| 地址 |
Beaverton OR US |
