| 摘要 |
An integrated circuit chip, an embedded type device and an integrated circuit processing method. The integrated circuit chip comprises a first chip and a conducting wire frame, wherein the first chip comprises a substrate, integrated circuit grains and/or passive elements arranged on an upper surface of the substrate, and an encapsulation colloid coating the upper surface of the substrate, the integrated circuit grains and/or the passive elements. A lower surface of the substrate is exposed outside the encapsulation colloid, a plurality of bonding pads are arranged on the lower surface of the substrate, and the plurality of bonding pads are electrically connected to the integrated circuit grains and/or the passive elements in the encapsulation colloid through a conducting circuit on the substrate. The conducting wire frame comprises chip pins, wherein the chip pins are electrically connected to the bonding pads. Due to the fact that only one surface of the substrate is encapsulated into the encapsulation colloid, only the heat expansion coefficients of two materials, i.e. the substrate and the encapsulation colloid need to be taken into consideration, the adjustment is facilitated, and therefore the processed integrated circuit chip is more stable and reliable. |
