| 摘要 |
PROBLEM TO BE SOLVED: To improve the isolation between terminals of a high frequency device in a high frequency package.SOLUTION: A high frequency package includes: first and second dielectric substrates opposite to each other; and a shield space surrounded by a connection conductor connecting between their dielectric substrates. The high frequency device is mounted on the first dielectric substrate in the shield space. An internal ground conductor is formed in the inside of the second dielectric substrate in a region opposite to the high frequency device. A barrier conductor connected to the internal ground conductor is formed so that the dielectric region surrounded by the internal ground conductor and the surface of the second dielectric substrate is partitioned. |
