| 摘要 |
PROBLEM TO BE SOLVED: To provide an electric copper plating solution analysis device and an electric copper plating solution analysis method that make a quantitative determination by theoretically finding parameters as to electrode reaction which additives and decomposition products thereof are concerned with when the state of an electric copper plating solution containing the additives is determined by applying a simple method of constant-current electrolysis.SOLUTION: An electric copper plating solution analysis device has an analysis part 31 which finds a parameter obtained on the basis of a reaction mechanism such that Cu(I) produced on a surface of a working electrode 18 in a process of deposition reaction of a copper plating film substitutes an inhibitor positioned on a surface of the working electrode 18 as the deposition reaction of the copper plating film advances and acts as an inhibitor and then specifies conditions of an electric plating solution using the parameter when analyzing the relation between elapsed time and potential. |
