发明名称 THERMAL TREATMENT DEVICE AND THERMAL TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a thermal treatment device which performs uniform thermal treatment processing over an entire periphery of a peripheral surface of an annular workpiece.SOLUTION: A thermal treatment device 100 includes: a heating coil 21 in which a pair of thermal treatment processing parts 20 is disposed facing a peripheral surface of a workpiece W; a first coolant discharge part 23 which is provided attached to the heating coil 21 and used to discharge a coolant; and a second coolant discharge part 25 which is installed at a position overlapping with the heating coil 21 and used to discharge the coolant. When the pair of thermal treatment processing parts 20 moves along the peripheral surface of the workpiece W in directions opposite to each other, the peripheral surface of the workpiece W heated by the heating coil 21 is sequentially cooled by the coolant discharged from the first coolant discharge part 23. When the pair of thermal treatment processing parts 20 moves to adjacent positions, cooling of the peripheral surface of the workpiece W heated by the heating coil 21 is conducted with the coolant including the coolant discharged from the second coolant discharge part 25.
申请公布号 JP2015173021(A) 申请公布日期 2015.10.01
申请号 JP20140047839 申请日期 2014.03.11
申请人 THK CO LTD;DENKI KOGYO CO LTD 发明人 NIIBE JUNZO;SAKANOUE TAKAYUKI;YOSHIYA KAZUKI;KAI HIROYUKI;MASUBUCHI SHUJI;NAGATA MAKOTO
分类号 H05B6/10;H05B6/42;H05B6/44 主分类号 H05B6/10
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