| 摘要 |
In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, said insulator outer surface and said copper layer outer surface are simultaneously subjected to (1) a process comprising treatment with an alkali metal hydroxide solution, (2) a process comprising treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process comprising treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt% and a pH of 8 to 1, (4) a process comprising treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polysty-renesulphonic acid, and (5) a process comprising copper electroplating, which are implemented sequentially. |
