HEAT-RADIATING MECHANISM FOR ELECTRONIC APPARATUS AND POWER SUPPLY DEVICE

摘要

An AC adapter (1A) according to the present invention is provided with an electronic component mounting substrate (10) in which electronic components (12) are mounted onto a substrate (11), and an upper housing (51) and lower housing (52) which house the electronic component mounting substrate (10). A heat-radiating mechanism (2) is provided with: a lower-side aluminum plate (42) which covers at least the rear side of the electronic component mounting substrate (10); and molded filler material (20) molded for insertion into a gap portion between the lower-side aluminum plate (42) and the rear side of the electronic component mounting substrate (10) where projecting portions (13) including a plurality of soldered portions have been formed, said molded filler material (20) being molded to have aperture portions (21) which match the shapes of the projecting portions (13).