| 摘要 |
The present invention relates to a securely adhering layer on ceramic and/or soldering resist which comprises a potting compound or a protective lacquer. The potting compound or the protective lacquer in this case is a plastics-based compound. In addition, the present invention relates to a method for producing such a securely adhering layer, in which method i) a ceramic substrate is roughened in an etching bath, ii) the ceramic substrate thus roughened is metallized by means of a metal paste, iii) the ceramic carrier thus metallized is processed to form a small ceramic chip with a housed LED or to form an open LED chip, iv) the housed LED or the open LED chip is connected to further electronic components on the metallized ceramic carrier, and v) a potting compound or a protective lacquer, which is a plastics-based compound, is applied to the carrier ceramic thus populated. Finally, the present invention also relates to a structural part having such a securely adhering layer. |
