发明名称 |
ENAMEL WIRE, CONDUCTOR WIRE PROCESSING DIE AND APPARATUS AND METHOD FOR PRODUCTION OF ENAMEL WIRE USING THE DIE |
摘要 |
PROBLEM TO BE SOLVED: To provide an enamel wire which is low-cost and is reduced in adverse effects due to split flaws of conductor wire and improved in adhesion between the conductor wire and the enamel coating and an apparatus and a method for production of an enamel wire which enables production of the enamel wire.SOLUTION: An enamel wire includes a conductor wire 1 and an enamel coating, and the conductor wire has a spiral groove 20 or two spiral grooves intersecting each other in the surface. The thickness of the enamel coating is 10 μm or greater; the depth of the groove(s) is 10-50 μm; and the pitch of the groove(s) is 50 μm or smaller. |
申请公布号 |
JP2015173074(A) |
申请公布日期 |
2015.10.01 |
申请号 |
JP20140049166 |
申请日期 |
2014.03.12 |
申请人 |
HITACHI METALS LTD |
发明人 |
SATO TAKUMI;TANAKA KOTARO;KIKUCHI HIDEYUKI;WATANABE YOSUKE |
分类号 |
H01B7/02;H01B13/16 |
主分类号 |
H01B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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