SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can be manufactured in less number of processes and ensure a sufficient bonding strength of a wire at a bonded part; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises: a loop wire 9 which is a first loop; and a loop wire 10 which is a second loop; a folded part 13 which is a part obtained by extracting the first loop from a ball bonded part 7 in a first direction and folding the first loop in a second direction. The second direction is a direction different from the first direction. The folded part 13 has a shape of being crushed toward the first bonded part. The second loop is bonded to the folded part 13. An end of the second loop is located on a second position. The second position is away from a first position in a direction where the first loop extends. The first position is the center of the first bonded part of the first loop.