HEAT CONDUCTIVE SHEET FOR SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a heat conductive sheet for a semiconductor module etc. which is less likely to be peeled from a heat radiation member.SOLUTION: A semiconductor module includes: a module body 100x in which a semiconductor element is resin-molded; a metal heat radiation member 20 which is exposed to the exterior so as to radiate heat emitted from the semiconductor element; and a heat conductive sheet 10 disposed between the module body and the heat radiation member. A heat conductive sheet for the semiconductor module 100 is used to form the semiconductor module and includes insulation layers 11, 12 including an inorganic filler and a thermosetting resin. In the semiconductor module, the heat conductive sheet is used with the insulation layers heat-sealed to the heat radiation member. The insulation layers contain gallic acid.