SOLID-STATE IMAGING DEVICE AND ELECTRONIC EQUIPMENT

摘要

A solid-state imaging device includes a pixel unit in which a plurality of pixels converting physical quantities into electric signals are arranged in a two-dimensional shape, a vertical signal line for reading signals from the pixels, and column circuits arranged corresponding to columns of the pixel unit and collecting the signals from the vertical signal line at the inside of the pixel unit.

主权项

1. A solid-state imaging device comprising:
a first substrate including a pixel array comprising a plurality of pixels that respectively covert physical quantities into electric signals, the plurality of pixels arranged in a two-dimensional shape, and a plurality of vertical signal lines that respectively receive the electric signals from corresponding ones of the plurality of pixels; and a second substrate including column circuits respectively arranged corresponding to columns of the plurality of pixels, wherein the first substrate and the second substrate are laminated and electrically connected to one another through a connection portion, and respective ones of the column circuits are configured to convey the electric signals in a vertical direction parallel to the plurality of vertical signal lines.