CONSTRAINED EPITAXIAL SOURCE/DRAIN REGIONS ON SEMICONDUCTOR-ON-INSULATOR FINFET DEVICE

摘要

A method of fabricating a semiconductor device includes forming a plurality of semiconductor fins on an insulator layer of a semiconductor substrate, and forming a plurality of gate stacks on the insulator layer. Each gate stack wraps around a respective portion of the semiconductor fins. The method further includes forming a dielectric layer on the insulator layer. The dielectric layer fills voids between the semiconductor fins and gate stacks, and covers the semiconductor fins. The method further includes etching at least one portion of the semiconductor fins until reaching the insulator layer such that at least one cavity is formed. The cavity exposes seed regions of the semiconductor fins located between adjacent gate stacks. The method further includes epitaxially growing a semiconductor material from the seed regions to form source/drain regions corresponding to a respective gate stack.

主权项

1. A method of fabricating a semiconductor device, the method comprising:
forming a plurality of semiconductor fins on an insulator layer of a semiconductor substrate, and forming a plurality of gate stacks on the insulator layer, each gate stack wrapping around a respective portion of the semiconductor fins; forming a dielectric layer on the insulator layer, the dielectric layer filling voids between the semiconductor fins and gate stacks, covering the semiconductor fins; etching at least one portion of the semiconductor fins until reaching the insulator layer such that at least one cavity is formed, the at least one cavity exposing seed regions of the semiconductor fins located between adjacent gate stacks; and epitaxially growing a semiconductor material from the seed regions to form source/drain regions corresponding to a respective gate stack.