发明名称 |
INDUCTOR EMBEDDED IN A PACKAGE SUBTRATE |
摘要 |
Some novel features pertain to a package substrate that includes a core layer, a first via, a first dielectric layer, and a first inductor. The core layer includes a first surface and a second surface. The first via is located in the core layer. The first dielectric layer is coupled to the first surface of the core layer. The first inductor is located in the first dielectric layer. The first inductor is coupled to the first via in the core layer. The first inductor is configured to generate a magnetic field that laterally traverses the package substrate. In some implementations, the package substrate further includes a first pad coupled to the first inductor, wherein the first pad is configured to couple to a solder ball. In some implementations, the package substrate includes a second via located in the core layer, and a second inductor located in the first dielectric layer. |
申请公布号 |
US2015279545(A1) |
申请公布日期 |
2015.10.01 |
申请号 |
US201414229367 |
申请日期 |
2014.03.28 |
申请人 |
QUALCOMM Incorporated |
发明人 |
Fazelpour Siamak;Paynter Charles David;Lane Ryan David |
分类号 |
H01F27/28;H01F27/29;H01F27/24 |
主分类号 |
H01F27/28 |
代理机构 |
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代理人 |
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主权项 |
1. A package substrate comprising:
a core layer comprising a first surface and a second surface; a first via located in the core layer; a first dielectric layer coupled to the first surface of the core layer; and a first inductor located in the first dielectric layer, the first inductor coupled to the first via in the core layer, wherein the first inductor is configured to generate a magnetic field that laterally traverses the package substrate. |
地址 |
San Diego CA US |