| 摘要 |
A glass substrate cutting device and cutting method. The device comprises a workbench, a cutting knife and a roller, wherein a glass substrate is transferred on the workbench; the cutting knife comprises an upper cutting knife and a lower cutting knife which are respectively arranged at an upper end and a lower end of the glass substrate and have oppositely arranged knife edges, so as to cut the glass substrate into two halves from two sides of the glass substrate, i.e. the upper side and the lower side; and the roller is arranged at the upper end of the glass substrate, and can press the glass substrate along a cutting crack on the glass substrate to crack same. The cutting device further comprises a high-pressure needle nozzle which is arranged between the cutting knife and the roller and can spray a high-pressure airflow along the cutting crack, so as to accelerate the cracking of the glass substrate. As a result of adding the high-pressure needle nozzle, a high-pressure airflow is sprayed at the crack when cutting is performed, so as to increase the pressure at the crack, thereby achieving an effect of quick cracking. |
