| 摘要 |
A pressing unit (66) having a pressing pin (66a) is attached to a molding die (64), semiconductor chips (12a, 12b), first and second heat sinks (22a, 22b, 30a, 30b), and solder pieces (40, 46) are disposed in a cavity (64c) of the molding die, then, the molding die is brought into a clamped state, and reflow is performed in a state wherein the first and second heat sinks are pressed to first and second wall surfaces (64d1, 64d2) by means of the pressing pin, thereby forming a laminated body (62). After the laminated body is formed, the pressing pin is pulled out from the cavity, a resin is injected, and a resin molded body (16) is formed. |
