发明名称 MOUNTING BOARD, METHOD FOR PRODUCING SAME, AND METHOD FOR MOUNTING COMPONENT
摘要 In the present invention, a mounting board is provided with a through hole (13) formed in a board (10), a first land section (21), a second land section (31), a first component mounting section (22), a second component mounting section (32), a conduction layer (14), and a filling member (15) filling a portion of the through hole (13). A shortest distance tolerance (L0) from the center of the first land section (21) to a component (51) that needs to be mounted onto the first component mounting section (22) is calculated on the basis of a volume (Vh) of a portion of the through hole (13) that is located above a top surface of the filling member (15) on the first land section (21) side, a length (L1) of the component (51), and a maximum tolerance for the incline of the component (51) needing to be mounted onto the first component mounting section (22) relative to a first surface (11) of the board (10).
申请公布号 WO2015146476(A1) 申请公布日期 2015.10.01
申请号 WO2015JP55785 申请日期 2015.02.27
申请人 SONY CORPORATION 发明人 WATANABE TOSHIHIKO
分类号 H05K3/34;H05K1/11;H05K1/18;H05K3/40 主分类号 H05K3/34
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