DIE MOUNTING SYSTEM AND DIE MOUNTING METHOD

摘要

A die mounting system configured so that a die supply device (12) is set onto a component mounting machine (11) and a die (22) supplied from the die supply device (12) is mounted onto a circuit board (17) by a mounting head (15) of the component mounting machine (11), wherein the next die handoff position is determined so that whichever of a period of time (Ta) necessary for die handoff preparatory operations (image capture and image processing of the die (22), die pickup operation, and movement and vertical flipping operations of a supply head) by the die supply device (12) and a period of time (Tb) necessary for die mounting operations (movement of the mounting head (15) and vertical operations at a mounting position) by the component mounting machine (11) is longer is reduced to lessen the difference in time between the two periods of time (which corresponds to wait time at the die handoff position) and shorten cycle time.