| 摘要 |
In order to suppress variation, between different product lots, in plating growth dimensions of a plating film forming an external electrode, a correlation is ascertained beforehand between the surface resistance value of a ceramic element (22), the amount of charge applied during electroplating, and actual plating growth dimensions ((L1) or (L1a)) obtained when plating using said amount of applied charge on the ceramic element having the surface resistance value. The amount of applied charge required during plating is determined by: measuring the surface resistance value of the ceramic element (22) upon which electroplating is to be performed and upon which plating films (33, 34) that will form the external electrode are to be formed as a result of the electroplating; and applying this surface resistance value and a design value for the target plating growth dimensions ((L1) or (L1a)) to this correlation. The ceramic element (22) is electroplated using the determined applied charge amount, because the plating films (33, 34) are formed after this step. |
