COLD TRANSFER AND HEAT DISSIPATION MODULAR ASSEMBLY, ASSEMBLY METHOD AND SEMICONDUCTOR REFRIGERATOR

摘要

A cold transfer and heat dissipation modular assembly (100), assembly method and semiconductor refrigerator, comprising: a proximal hot end heat dissipation device (10) and having a heat pipe (12), a distal cold end cold transfer device (20) having a heat pipe (22) and a semiconductor cooling plate (30) and a heat conducting block (40) therebetween, the heat conducting block (40) being disposed between the semiconductor cooling plate (30) and the cold end cold transfer device (20). After assembling the components, foaming the assembled components to form a heat insulation layer (50) circumferentially enclosing the semiconductor cooling plate (30) and the heat conducting block (40) between the cold transfer surface of the cold end cold transfer device (20) and the heat transfer surface of the hot end heat dissipation device (10).