| 摘要 |
<p>The present invention relates to a semiconductor package handler, more specifically, in a semiconductor package handler for performing visual inspection, an electric property inspection, a marking operation, a selecting operation of a defect product, and a final packing operation of a good product by receiving a semiconductor package from a feeder to a semiconductor package handler which provides the feeder for a package consecutively supplied at the high speed in a vibrating rotation plate capable of doing an ultra-high speed inspection (20,000 ea/hr or more), to be accurately supplied to a mounting block of a turn table passing through an arc type supply rail (one oscillator provided to the vibrating rotation plate is enough) or a straight line type supply rail (an extra oscillator is mounted as necessary). Furthermore, the invention comprises a vision inspection unit for performing visual inspection as the first and second inspection units for inspecting individually photograph a lower surface and a side surface of the semiconductor package, allowing for an errorless inspection by arranging a test unit for the electric property inspection after the first inspection unit, and enabling for a more perfect quality inspection due to arranging the second inspection unit thereafter. Thereby, the handler not only increases accuracy and reliability with the ultra-high speed inspection, but also eventually enables the packing operation to be performed.</p> |
