发明名称 ELECTRIC CIRCUIT ON FLEXIBLE SUBSTRATE
摘要 Generally discussed herein are systems and apparatuses that can include a flexible substrate with a hermetic seal formed thereon. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a hermetic seal on a flexible substrate can include (1) forming an interconnect on a flexible substrate, (2) situating a device on the substrate near the interconnect, or (3) selectively depositing a first hermetic material on the device or interconnect so as to hermetically seal the device within the combination of the interconnect and first hermetic material.
申请公布号 US2015282341(A1) 申请公布日期 2015.10.01
申请号 US201414227779 申请日期 2014.03.27
申请人 Intel Corporation 发明人 Hu Chuan;Kumar Siddarth
分类号 H05K5/00;H05K1/11;H05K5/06;H05K1/18;H05K3/30;H05K1/03 主分类号 H05K5/00
代理机构 代理人
主权项 1. A method comprising: forming an interconnect on a flexible substrate; situating a device on the substrate near the interconnect; and selectively depositing a first hermetic material on the device and interconnect so as to hermetically seal the device within the combination of the interconnect and first hermetic material.
地址 Santa Clara CA US