发明名称 |
ELECTRIC CIRCUIT ON FLEXIBLE SUBSTRATE |
摘要 |
Generally discussed herein are systems and apparatuses that can include a flexible substrate with a hermetic seal formed thereon. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a hermetic seal on a flexible substrate can include (1) forming an interconnect on a flexible substrate, (2) situating a device on the substrate near the interconnect, or (3) selectively depositing a first hermetic material on the device or interconnect so as to hermetically seal the device within the combination of the interconnect and first hermetic material. |
申请公布号 |
US2015282341(A1) |
申请公布日期 |
2015.10.01 |
申请号 |
US201414227779 |
申请日期 |
2014.03.27 |
申请人 |
Intel Corporation |
发明人 |
Hu Chuan;Kumar Siddarth |
分类号 |
H05K5/00;H05K1/11;H05K5/06;H05K1/18;H05K3/30;H05K1/03 |
主分类号 |
H05K5/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method comprising:
forming an interconnect on a flexible substrate; situating a device on the substrate near the interconnect; and selectively depositing a first hermetic material on the device and interconnect so as to hermetically seal the device within the combination of the interconnect and first hermetic material. |
地址 |
Santa Clara CA US |