发明名称 |
EDGE CONTACTS OF CIRCUIT BOARDS, AND RELATED APPARATUS AND METHODS |
摘要 |
In some embodiments, flat electrical contact pads may be fabricated along a routed edge face of a printed wiring board (PWB). Some embodiments of the edge pads may, for example, be perpendicular to a plane of the printed wiring board. In some embodiments, the edge pads may be of a specified length and/or width. Some embodiments of the edge pads may, for example, have a surface finish suitable for soldering and/or for direct contact interconnections. In some embodiments, the edge pads may, for example, be configured for electrical connection to an adjoining device (e.g., PWB) with mating pads to form a tiled array configuration of interconnected devices (e.g., PWBs). |
申请公布号 |
US2015282317(A1) |
申请公布日期 |
2015.10.01 |
申请号 |
US201414228866 |
申请日期 |
2014.03.28 |
申请人 |
Lockheed Martin Corporation |
发明人 |
Gonya Stephen;Dougherty Timothy J.;Fisher Jeffrey;Hochdoerfer Michael;Twigg Kenneth R.;Urda Eugene J. |
分类号 |
H05K1/11;H05K3/00;H05K3/46;H05K1/02 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
1. A circuit board, comprising:
a plurality of layers stacked in a thickness direction; a peripheral edge having a first thickness in the thickness direction; and an edge contact disposed at the peripheral edge of the circuit board, the edge contact having a second thickness in the thickness direction, the second thickness being less than the first thickness. |
地址 |
Bethesda MD US |