发明名称 EDGE CONTACTS OF CIRCUIT BOARDS, AND RELATED APPARATUS AND METHODS
摘要 In some embodiments, flat electrical contact pads may be fabricated along a routed edge face of a printed wiring board (PWB). Some embodiments of the edge pads may, for example, be perpendicular to a plane of the printed wiring board. In some embodiments, the edge pads may be of a specified length and/or width. Some embodiments of the edge pads may, for example, have a surface finish suitable for soldering and/or for direct contact interconnections. In some embodiments, the edge pads may, for example, be configured for electrical connection to an adjoining device (e.g., PWB) with mating pads to form a tiled array configuration of interconnected devices (e.g., PWBs).
申请公布号 US2015282317(A1) 申请公布日期 2015.10.01
申请号 US201414228866 申请日期 2014.03.28
申请人 Lockheed Martin Corporation 发明人 Gonya Stephen;Dougherty Timothy J.;Fisher Jeffrey;Hochdoerfer Michael;Twigg Kenneth R.;Urda Eugene J.
分类号 H05K1/11;H05K3/00;H05K3/46;H05K1/02 主分类号 H05K1/11
代理机构 代理人
主权项 1. A circuit board, comprising: a plurality of layers stacked in a thickness direction; a peripheral edge having a first thickness in the thickness direction; and an edge contact disposed at the peripheral edge of the circuit board, the edge contact having a second thickness in the thickness direction, the second thickness being less than the first thickness.
地址 Bethesda MD US