THERMAL MANAGEMENT STRUCTURES FOR OPTOELECTRONIC MODULES

摘要

An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

主权项

1. An optoelectronic module comprising:
a lens assembly; a module board including a printed circuit board (PCB), wherein the lens assembly is secured to the module board; heat-generating components mounted to the PCB; and a thermally conductive plate secured to a surface of the module board, wherein the thermally conductive plate defines an opening that receives at least a portion of the lens assembly and the thermally conductive plate is configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.