SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

An aligning guide, a semiconductor package comprising an aligning guide, and a method of manufacturing a semiconductor package comprising an aligning guide are provided. The semiconductor package may comprise a circuit board and an aligning guide mounted on the circuit board. The aligning guide may have a plurality of stepped portions. A plurality of semiconductor chips may be stacked on the circuit board and engage with the stepped portions of the aligning guide. According to the disclosed semiconductor package, a large number of semiconductor chips may be stacked with high accuracy and sufficient margin. Therefore, the rate of failure and defects in the chip stacking process may be reduced and the reliability and stability of the semiconductor package may be enhanced.

主权项

1. A semiconductor package comprising:
a first circuit board; an aligning guide mounted on the circuit board and having a plurality of stepped portions; and a plurality of semiconductor chips stacked one on top of another on the circuit board and contacting respective stepped portions of the aligning guide.