| 摘要 |
Light emitter packages (10, 30, 50, 120), systems (90, 100, 110), and methods having multiple light emitter chips and operable at multiple voltages are provided. In some aspects, light emitter packages described herein include a submount (12) having a plurality of contact pads (26', 26", 28', 28", 132A, 132B, 132C, and 132D) and a plurality of light emitting diode (LED) chips (14, 40, 62) disposed over one or more surfaces thereof. The plurality of contact pads (26', 26", 28', 28", 132A, 132B, 132C, and 132D) are configured to pass electrical current into the plurality of LED chips (14, 40, 62) for allowing the package (10, 30, 50, 120) to be operable in at least two different voltages. The package (10, 30, 50, 120) can be operable at approximately 3 volts (V) or more, approximately 6V or more, approximately 9 V or more, approximately 12V or more, approximately 18 V or more, or approximately 36 V or more. |
