发明名称 |
BONDING OF COMPOSITE MATERIALS |
摘要 |
A composite bonding process is disclosed. At least one of two curable, resin-based composite substrates is partially cured to a degree of cure of at least 10% but less than 75% of full cure. The composite substrates are then joined to each other with a curable adhesive there between. Co-curing of the joined substrates is carried out to form a bonded composite structure, whereby the adhesive is chemically bonded to and mechanically diffused with the resin matrix of the composite substrates, resulting in a chemically bonded interface between the adhesive and each composite substrate. Furthermore, bonding can occur with the presence of contaminants on the joined surfaces. |
申请公布号 |
EP2922685(A2) |
申请公布日期 |
2015.09.30 |
申请号 |
EP20130799452 |
申请日期 |
2013.11.18 |
申请人 |
CYTEC INDUSTRIES INC. |
发明人 |
MACADAMS, LEONARD, A.;KOHLI, DALIP, K. |
分类号 |
B29C65/00;B29C65/48;B29C70/30;B29L31/30;C09J5/02;F16B11/00 |
主分类号 |
B29C65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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