Semiconductor device with a sensor connected to an external element

摘要

A semiconductor device includes: a sensor element (10) having a plate shape with a surface and including a sensor structure (15 to 17) disposed in a surface portion of the sensor element (10); and a plate-shaped cap element (20) bonded to the surface of the sensor element (10). The cap element (20) has a wiring pattern portion (23 to 25) facing the sensor element (10). The wiring pattern portion (23 to 25) connects an outer periphery of the surface of the sensor element (10) and the sensor structure (15 to 17) so that the sensor structure (15 to 17) is electrically coupled with an external element via the outer periphery. The sensor element (10) does not have a complicated multi-layered structure, so that the sensor element (10) is simplified. Further, the dimensions of the device are reduced.