| 摘要 |
An automatic soldering apparatus using an induction electromagnet is provided to simplify the structure of an electromagnet without using a pump by magnetically levitating solder melted in a melting space by a magnetic field generating apparatus so that the solder comes in contact with a circuit board. A melting space(50) in which a heater(40) is installed is prepared in the center of a main body(10). An electromagnet core assembly(60) is installed at both sides of the outside of the melting space. A levitating path(80) connected to a nozzle(30) is installed between the inner wall of the melting space and a magnet(70) so that the solder melted in the melting space is magnetically levitated to be supplied to a circuit board through a nozzle in a work position. A cooling fan(90) can be installed under both external sides of the main body to cool the electromagnet core assembly.
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