发明名称 METHOD FOR FORMING METAL FILM AND METAL FILM OBTAINED BY THE METHOD
摘要 <P>PROBLEM TO BE SOLVED: To obtain a metal film whose electric resistance is remarkably reduced compared with the case where heat treatment is performed under the atmospheric pressure. <P>SOLUTION: The method for forming a metal film comprises: a stage where the surface of a base material is coated with a metal colloid in which metal colloid particles are composed of metal particles and a protective agent coordinated on the surfaces of particles for modification , wherein the protective agent has a carbon skeleton comprising either or both of nitrogen and oxygen in the molecule, and also has a structure of being coordinated on the surfaces of the metal particles for modification with one or more kinds selected from the group consisting of nitrogen, oxygen, a nitrogen-containing atomic group and an oxygen-containing atomic group as an anchor, and has a hydroxyalkyl group in the molecular structure, and obtained by mixing the metal colloid particles at a prescribed ratio into either dispersion medium of a water system or a non-water system or a dispersion medium prepared by mixing them, so as to be dispersed; a stage where the dispersion medium in the coated metal colloid is removed by natural drying; and a stage where the base material is heat-treated at &le;200&deg;C in a vacuum atmosphere of &le;1.0&times;10<SP>3</SP>Pa, thus a metal film is formed on the surface of the base material. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008095182(A) 申请公布日期 2008.04.24
申请号 JP20070225247 申请日期 2007.08.31
申请人 MITSUBISHI MATERIALS CORP 发明人 HAYASHI TOSHIHARU;IZUMI REIKO
分类号 C23C20/04 主分类号 C23C20/04
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