发明名称 LIGHT-EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To prevent the deterioration of the performance of a device by reducing dislocation density even if a phosphor is arranged in the element. <P>SOLUTION: An LED chip 1, where an epitaxial layer 14 that has a light emitting layer is formed on a surface 11a of a deposition substrate 11, includes: concave portions 11b formed to the surface 11a of the deposition substrate 11; yellow fluorescence parts 12 arranged on each of the concave portions 11b of the deposition substrate 11, the parts 12 containing the phosphors that emit a wavelength-converting light by being excited by light emitted from the light emitting layer; and a coating layer 13 that consists of a material onto which the epitaxial layer 14 can be deposited, the layer 13 covering the surface 11a of deposition substrate 11 along with each of the yellow fluorescence parts 12. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008098526(A) 申请公布日期 2008.04.24
申请号 JP20060280731 申请日期 2006.10.13
申请人 TOYODA GOSEI CO LTD 发明人 WADA SATOSHI;INASAWA RYOHEI
分类号 H01L33/06;H01L33/32;H01L33/50;H01L33/62 主分类号 H01L33/06
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