| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC tag label having a protection structure of an IC chip, not causing a jump in production cost, and stuck to an article without generating a level difference. <P>SOLUTION: This IC tag label 1 is a non-contact IC tag label formed with an antenna pattern 2 and installed with the IC chip 3 on an inlet base material 11 face, having an adhesive layer 6 protected by a release paper 7 on a face opposite to the antenna pattern 2, and having an antenna pattern 2 face covered with a surface protection sheet 4. The release paper 7 and the adhesive layer 6 in a portion just under the IC chip 3 are formed with a circular or rectangular opening 12 surrounding the IC chip 3. In some embodiments, the surface protection sheet 4 can be omitted. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
