发明名称 SEALING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a sealing material of which, during baking, the thermal expansion coefficient does not increase and the flowability is not impaired, by preparing a cordierite powder having a surface layer which hardly melts into bismuth-based glass, for example, even when the burning temperature is higher than 500°C. SOLUTION: The sealing material contains a bismuth-based glass powder and a cordierite powder which has been prepared by a solid-phase reaction. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008094711(A) 申请公布日期 2008.04.24
申请号 JP20070237369 申请日期 2007.09.13
申请人 NIPPON ELECTRIC GLASS CO LTD 发明人 KIKUTANI TAKETAMI;AMANO YASUSHI;YAMADA TOMOKO
分类号 C03C8/24;H01J9/26;H01J11/02;H01J11/46;H01J11/48 主分类号 C03C8/24
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