发明名称 |
Manifold for a Two-Phase Cooling System |
摘要 |
A manifold for a two-phase cooling system for efficiently transferring coolant within a multi-phase cooling system. The manifold for a two-phase cooling system generally includes an extruded manifold having a supply chamber and a return chamber in thermal communication with one another to provide for efficient coolant transfer between a thermal server and a spray module.
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申请公布号 |
US2008093054(A1) |
申请公布日期 |
2008.04.24 |
申请号 |
US20070846510 |
申请日期 |
2007.08.28 |
申请人 |
TILTON CHARLES L;TILTON DONALD E;HYDE TONY E;KNIGHT PAUL A;DARNTON BRYAN M;DUNHAM BRIAN P |
发明人 |
TILTON CHARLES L.;TILTON DONALD E.;HYDE TONY E.;KNIGHT PAUL A.;DARNTON BRYAN M.;DUNHAM BRIAN P. |
分类号 |
F28D15/00 |
主分类号 |
F28D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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