<p>An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.</p>
申请公布号
WO2008048444(A1)
申请公布日期
2008.04.24
申请号
WO2007US21629
申请日期
2007.10.10
申请人
LAM RESEARCH CORPORATION;LARSON, DEAN, J.;BROWN, DANIEL;COMENDANT, KEITH;WANG, VICTOR
发明人
LARSON, DEAN, J.;BROWN, DANIEL;COMENDANT, KEITH;WANG, VICTOR