| 摘要 |
A high inductance, out-of -plane inductor is achieved by forming on a flat flexible base (103) conductive elements (105) that are arranged in a pattern such that when the flat flexible base, e.g., a polymer film, is curled, e.g., by application of heat, the conductive elements are likewise curled and opposite ends of different ones of the conductive elements are brought into conductive contact, and may be bonded, so as to form a conductive coil using at least two of the conductive elements. Additional conductors (109) may be formed on the flexible base to act as wires to provide connections to the resulting conductive coil. A portion of the flexible base, e.g., extending beyond the coil, can serve as a base to which one or more chips, e.g., flip-chip mounted, or other components are attached. |
